| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Logic Family | HC |
| Logic Function | NAND |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 8-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 130@2V|26@4.5V|22@6V |
| Absolute Propagation Delay Time (ns) | 195 |
| Process Technology | CMOS |
| Maximum Low Level Output Current (mA) | 5.2 |
| Maximum High Level Output Current (mA) | -5.2 |
| Minimum Operating Supply Voltage (V) | 2 |
| Typical Operating Supply Voltage (V) | 5 |
| Maximum Operating Supply Voltage (V) | 6 |
| Maximum Quiescent Current (uA) | 2 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 1.05(Max) mm |
| Package Width | 4.5(Max) mm |
| Package Length | 5.1(Max) mm |
| PCB changed | 14 |
| Standard Package Name | SO |
| Supplier Package | TSSOP |
| Pin Count | 14 |
