| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | LVDS |
| Number of Channels per Chip | 4 |
| Maximum Data Rate | 2.5Gbps(Min) |
| Maximum Rise Time (ns) | 0.18 |
| Maximum Fall Time (ns) | 0.18 |
| Output Type | Logic |
| Maximum Operating Supply Voltage (V) | 1.9 |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Maximum Propagation Delay Time (tPHL) (ns) | 2.8 |
| Minimum Isolation Voltage (Vrms) | 1500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 2.8 |
| Maximum Working Insulation Voltage | 560Vp |
| Maximum Power Dissipation (mW) | 4120 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tray |
| Forward/Reverse Channels | 2/2 |
| Minimum Common Mode Rejection (kV/us) | 40 |
| Supplier Temperature Grade | Industrial |
| Mounting | Surface Mount |
| Package Height | 0.73 |
| Package Width | 6 |
| Package Length | 6 |
| PCB changed | 32 |
| Standard Package Name | CSP |
| Supplier Package | LFCSP EP |
| Pin Count | 32 |
