| Compliant | |
| EAR99 | |
| Obsolete | |
| 8542.33.00.01 | |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 1(Max) mm |
| Package Width | 1.35(Max) mm |
| Package Length | 2.2(Max) mm |
| PCB changed | 6 |
| Standard Package Name | SO |
| Supplier Package | TSSOP |
| 6 | |
| Lead Shape | Gull-wing |
This general purpose amplifier BGU7031,115 buffer amplifier, developed by NXP Semiconductors, will adjust an RF signal to meet your project's specifications. Its maximum power dissipation is 250 mW. This RF amplifier chip has a minimum operating temperature of -10 °C and a maximum of 70 °C. This product will be shipped in tape and reel packaging for quick mounting and safe delivery. This device uses a single power supply. It has a single channel per chip.
| EDA / CAD Models |