| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | LTB |
| HTS | 8542.33.00.01 |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 1(Max) mm |
| Package Width | 1.35(Max) mm |
| Package Length | 2.2(Max) mm |
| PCB changed | 6 |
| Standard Package Name | SO |
| Supplier Package | TSSOP |
| Pin Count | 6 |
| Lead Shape | Gull-wing |
You can boost an RF signal by applying this general purpose amplifier BGU7044,115 buffer amplifier from NXP Semiconductors. Its maximum power dissipation is 250 mW. This RF amplifier chip has a minimum operating temperature of -40 °C and a maximum of 85 °C. This product will be shipped in tape and reel packaging so that components can be mounted effectively. This device uses a single power supply. It has a single channel per chip.
