| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | LTB |
| HTS | 8542.33.00.01 |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 0.72 mm |
| Package Width | 2 mm |
| Package Length | 2 mm |
| PCB changed | 8 |
| Standard Package Name | SON |
| Supplier Package | HWSON EP |
| Pin Count | 8 |
| Lead Shape | No Lead |
Have a weak RF signal? Amplify it with this general purpose amplifier BGU8053X buffer amplifier from NXP Semiconductors, to ease up your processor. Its maximum power dissipation is 510 mW. This RF amplifier chip has a maximum operating temperature of 150 °C. In order to ensure safe delivery and enable quick mounting of this component after delivery, it will be encased in tape and reel packaging during shipment. This device uses a single power supply. It has a single channel per chip.
