CUI Devices-HSB01-080808 ヒートシンク 8.5 x 8.5 mm, BGA Heat Sink, Aluminum, PCB

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CUI DevicesHSB01-080808ヒートシンク

8.5 x 8.5 mm, BGA Heat Sink, Aluminum, PCB

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Symbols and Footprints

Compliant

EAR99

Active

8542.90.00.00

Automotive

No

PPAP

No

EDA / CAD Models

No Stock Available

Quantity Increments of 1 Minimum 3672

Manufacturer Lead Time:
ManufacturerLeadTime
- Price: $0.5477
1. 3672+$0.5477
2. 10000+$0.5341
3. 25000+$0.5211