CUI Devices-HSB17-404025 ヒートシンク 40 x 40 mm, BGA Heat Sink, Aluminum, PCB

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CUI DevicesHSB17-404025ヒートシンク

40 x 40 mm, BGA Heat Sink, Aluminum, PCB

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EAR99

Active

EA

Automotive

No

PPAP

No

EDA / CAD Models

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アメリカ合衆国
Manufacturer Lead Time:
16 週間
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