| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Driver Type | High and Low Side |
| Bridge Type | 3-Phase Bridge |
| Number of Drivers | 6 |
| High and Low Sides Dependency | Independent |
| Type | IGBT|MOSFET |
| Process Technology | HVIC |
| Number of Outputs | 6 |
| Maximum Rise Time (ns) | 125 |
| Maximum Fall Time (ns) | 55 |
| Maximum Propagation Delay Time (ns) | 850 |
| Input Logic Compatibility | 2.5V(Min)|CMOS|LSTTL |
| Minimum Operating Supply Voltage (V) | 10 |
| Maximum Operating Supply Voltage (V) | 20 |
| Typical Input Low Threshold Voltage (V) | 0.8(Max) |
| Typical Input High Threshold Voltage (V) | 2.2(Min) |
| Maximum Power Dissipation (mW) | 1600 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Special Features | Current Sensing|Undervoltage Lockout |
| Packaging | Tape and Reel |
| Mounting | Surface Mount |
| Package Height | 2.35(Max) |
| Package Width | 7.6(Max) |
| Package Length | 18.1(Max) |
| PCB changed | 28 |
| Standard Package Name | SO |
| Supplier Package | SOIC W |
| Pin Count | 28 |
| Lead Shape | Gull-wing |
