欧州RoHS | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.32.00.02 |
Automotive | No |
PPAP | No |
DRAM Type | SDRAM |
Chip Density (bit) | 16M |
Organization | 1Mx16 |
Number of Internal Banks | 2 |
Number of Words per Bank | 512K |
Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 143 |
Maximum Access Time (ns) | 5.5|6 |
Address Bus Width (bit) | 12 |
Interface Type | LVTTL |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Operating Current (mA) | 70 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Number of I/O Lines (bit) | 16 |
Mounting | Surface Mount |
Package Height | 1.05(Max) |
Package Width | 10.16 |
Package Length | 20.95 |
PCB changed | 50 |
Standard Package Name | SO |
Supplier Package | TSOP-II |
Pin Count | 50 |
Lead Shape | Gull-wing |