| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | SPI|I2C |
| Number of Channels per Chip | 6 |
| Maximum Data Rate | 20Mbps |
| Maximum Rise Time (ns) | 35 |
| Maximum Fall Time (ns) | 35 |
| Output Type | Logic |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Maximum Propagation Delay Time (tPHL) (ns) | 100 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 100 |
| Maximum Working Insulation Voltage | 560Vp |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Packaging | Tray |
| Forward/Reverse Channels | 3/3 |
| Minimum Common Mode Rejection (kV/us) | 30 |
| Supplier Temperature Grade | Industrial |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 2.82 mm |
| Package Width | 11.25 mm |
| Package Length | 15 mm |
| PCB changed | 32 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| Pin Count | 32 |
| Lead Shape | Ball |
