NXP SemiconductorsMC13892CJVLPMICソリューション
Application Processors to 186-Pin BGA Tray
| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.60 | |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| Application Processors | |
| -40 | |
| 85 | |
| Tray | |
| 150 | |
| -65 | |
| Mounting | Surface Mount |
| Package Height | 1.18 mm |
| Package Width | 12 mm |
| Package Length | 12 mm |
| PCB changed | 186 |
| Standard Package Name | BGA |
| Supplier Package | BGA |
| 186 | |
| Lead Shape | Ball |
| EDA / CAD Models |