| 欧州RoHS | Compliant |
| ECCN (US) | 3A991b.1.a. |
| Part Status | NRND |
| HTS | 8542.32.00.51 |
| Automotive | No |
| PPAP | No |
| Cell Type | SLC NAND |
| Chip Density (bit) | 8G |
| Architecture | Sectored |
| Boot Block | No |
| Block Organization | Symmetrical |
| Address Width (bit) | 31 |
| Sector Size | 128Kbyte x 8192 |
| Page Size | 2Kbyte |
| Number of Bits/Word (bit) | 8 |
| Number of Words | 1G |
| Programmability | Yes |
| Timing Type | Asynchronous |
| Maximum Erase Time (s) | 0.003/Block |
| Maximum Programming Time (ms) | 0.6 |
| Interface Type | Parallel |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Operating Current (mA) | 35 |
| Program Current (mA) | 35 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Command Compatible | No |
| ECC Support | Yes |
| Support of Page Mode | Yes |
| Minimum Endurance (Cycles) | 100000 |
| Mounting | Surface Mount |
| Package Height | 1(Max) - 0.25(Min) |
| Package Width | 9 |
| Package Length | 11 |
| PCB changed | 63 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| Pin Count | 63 |
| Lead Shape | Ball |
