欧州RoHS | Compliant |
ECCN (US) | 3A991b.1.a. |
Part Status | NRND |
HTS | 8542.32.00.71 |
Automotive | No |
PPAP | No |
Cell Type | NOR |
Chip Density (bit) | 512M |
Architecture | Sectored |
Boot Block | No |
Block Organization | Symmetrical |
Address Width (bit) | 25 |
Page Size | 16byte |
Number of Bits/Word (bit) | 8/16 |
Number of Words | 64M/32M |
Programmability | Yes |
Timing Type | Asynchronous |
Max. Access Time (ns) | 110 |
Maximum Erase Time (s) | 500/Chip |
Maximum Page Access Time (ns) | 30 |
Maximum Programming Time (ms) | 700000/Chip |
OE Access Time (ns) | 30 |
Interface Type | Parallel |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Programming Voltage (V) | 2.7 to 3.6 |
Operating Current (mA) | 30 |
Page Read Current (mA) | 15 |
Program Current (mA) | 30 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Command Compatible | Yes |
ECC Support | No |
Support of Page Mode | Yes |
Minimum Endurance (Cycles) | 100000 |
Mounting | Surface Mount |
Package Height | 0.65(Min) |
Package Width | 11 |
Package Length | 13 |
PCB changed | 64 |
Standard Package Name | BGA |
Supplier Package | LFBGA |
Pin Count | 64 |
Lead Shape | Ball |