| 欧州RoHS | Compliant |
| ECCN (US) | 3A991.b.2 |
| Part Status | Active |
| HTS | 8542.32.00.41 |
| Chip Density (bit) | 64M |
| Number of Words | 8M |
| Number of Bits/Word (bit) | 8 |
| Data Rate Architecture | DDR |
| Address Bus Width (bit) | 32 |
| Number of Ports | 1 |
| Timing Type | Synchronous |
| Maximum Access Time (ns) | 35(Min) |
| Maximum Clock Rate (MHz) | 200 |
| Process Technology | 38nm |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 2 |
| Maximum Operating Supply Current (mA) | 30 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 1(Max) - 0.2(Min) |
| Package Width | 6 |
| Package Length | 8 |
| PCB changed | 24 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 24 |
