Digital Isolator CMOS 2-CH 1Mbps 8-Pin SOIC N T/R Automotive AEC-Q100
| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | NRND |
| HTS | 8541.49.80.00 |
| Automotive | Yes |
| PPAP | Unknown |
| Type | General Purpose |
| Number of Channels per Chip | 2 |
| Maximum Data Rate | 1Mbps |
| Maximum Rise Time (ns) | 5 |
| Maximum Fall Time (ns) | 3.7 |
| Minimum Pulse Width (ns) | 6(Max) |
| Maximum Pulse Width Distortion (ns) | 25 |
| Maximum Propagation Delay Skew (ns) | 40 |
| Output Type | CMOS |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Maximum Propagation Delay Time (tPHL) (ns) | 35 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 35 |
| Maximum Working Insulation Voltage | 560Vp |
| Maximum Quiescent Supply Current (mA) | 4.2 |
| Maximum Output Current Drive (mA) | 10 |
| Maximum Power Dissipation (mW) | 150 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Typical Operating Supply Voltage (V) | 3.3|5 |
| Forward/Reverse Channels | 1/1 |
| Minimum Common Mode Rejection (kV/us) | 25(Typ) |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 4(Max) |
| Package Length | 5(Max) |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 8 |
| EDA / CAD Models |
|
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Digital Isolator CMOS 2-CH 1Mbps 8-Pin SOIC N T/R Automotive AEC-Q100
| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | NRND |
| HTS | 8541.49.80.00 |
| Automotive | Yes |
| PPAP | Unknown |
| Type | General Purpose |
| Number of Channels per Chip | 2 |
| Maximum Data Rate | 1Mbps |
| Maximum Rise Time (ns) | 5 |
| Maximum Fall Time (ns) | 3.7 |
| Minimum Pulse Width (ns) | 6(Max) |
| Maximum Pulse Width Distortion (ns) | 25 |
| Maximum Propagation Delay Skew (ns) | 40 |
| Output Type | CMOS |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Maximum Propagation Delay Time (tPHL) (ns) | 35 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 35 |
| Maximum Working Insulation Voltage | 560Vp |
| Maximum Quiescent Supply Current (mA) | 4.2 |
| Maximum Output Current Drive (mA) | 10 |
| Maximum Power Dissipation (mW) | 150 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Typical Operating Supply Voltage (V) | 3.3|5 |
| Forward/Reverse Channels | 1/1 |
| Minimum Common Mode Rejection (kV/us) | 25(Typ) |
| Coupling Type | Capacitive Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 4(Max) |
| Package Length | 5(Max) |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 8 |
| EDA / CAD Models |
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