Digital Isolator Three State 1-CH 1Mbps 8-Pin SOIC N T/R
| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | General Purpose |
| Number of Channels per Chip | 1 |
| Maximum Data Rate | 1Mbps |
| Maximum Rise Time (ns) | 4 |
| Maximum Fall Time (ns) | 4 |
| Minimum Pulse Width (ns) | 250 |
| Maximum Pulse Width Distortion (ns) | 25 |
| Maximum Propagation Delay Skew (ns) | 40 |
| Output Type | Three State |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 2.5 |
| Maximum Propagation Delay Time (tPHL) (ns) | 35 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 35 |
| Maximum Working Insulation Voltage | 630Vp |
| Maximum Quiescent Supply Current (mA) | 2/1.5 |
| Maximum Output Current Drive (mA) | 22 |
| Maximum Power Dissipation (mW) | 150 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Forward/Reverse Channels | 1/0 |
| Minimum Common Mode Rejection (kV/us) | 35 |
| Coupling Type | Magnetic Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 4(Max) |
| Package Length | 5(Max) |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 8 |
| EDA / CAD Models |
|
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Digital Isolator Three State 1-CH 1Mbps 8-Pin SOIC N T/R
| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.60 |
| Automotive | No |
| PPAP | No |
| Type | General Purpose |
| Number of Channels per Chip | 1 |
| Maximum Data Rate | 1Mbps |
| Maximum Rise Time (ns) | 4 |
| Maximum Fall Time (ns) | 4 |
| Minimum Pulse Width (ns) | 250 |
| Maximum Pulse Width Distortion (ns) | 25 |
| Maximum Propagation Delay Skew (ns) | 40 |
| Output Type | Three State |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Operating Supply Voltage (V) | 2.5 |
| Maximum Propagation Delay Time (tPHL) (ns) | 35 |
| Minimum Isolation Voltage (Vrms) | 2500 |
| Maximum Propagation Delay Time (tPLH) (ns) | 35 |
| Maximum Working Insulation Voltage | 630Vp |
| Maximum Quiescent Supply Current (mA) | 2/1.5 |
| Maximum Output Current Drive (mA) | 22 |
| Maximum Power Dissipation (mW) | 150 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Forward/Reverse Channels | 1/0 |
| Minimum Common Mode Rejection (kV/us) | 35 |
| Coupling Type | Magnetic Coupling |
| Mounting | Surface Mount |
| Package Height | 1.5(Max) |
| Package Width | 4(Max) |
| Package Length | 5(Max) |
| PCB changed | 8 |
| Standard Package Name | SO |
| Supplier Package | SOIC N |
| Pin Count | 8 |
| EDA / CAD Models |
注目の製品
