| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.71 |
| Automotive | No |
| PPAP | No |
| Cell Type | NAND |
| Chip Density (bit) | 16M |
| Architecture | Sectored |
| Boot Block | Yes |
| Block Organization | Symmetrical |
| Location of Boot Block | Bottom |
| Address Width (bit) | 21 |
| Sector Size | 4Kbyte x 512 |
| Number of Bits/Word (bit) | 8 |
| Number of Words | 2M |
| Programmability | Yes |
| Timing Type | Asynchronous |
| Max. Access Time (ns) | 70 |
| Maximum Erase Time (s) | 0.05/Chip |
| Maximum Programming Time (ms) | 0.01/Byte |
| OE Access Time (ns) | 35 |
| Interface Type | Parallel |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Programming Voltage (V) | 2.7 to 3.6 |
| Operating Current (mA) | 18 |
| Program Current (mA) | 35 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Command Compatible | Yes |
| ECC Support | No |
| Support of Page Mode | No |
| Minimum Endurance (Cycles) | 10000 |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 0.75 |
| Package Width | 6 |
| Package Length | 8 |
| PCB changed | 48 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 48 |
| Lead Shape | Ball |
