NXP Semiconductors TDA8035HN/C1/S1EL スマートカードインターフェース
Smart Card Interface 27MHz 3.3V 450mW Tray 32-Pin HVQFN EP

Smart Card Interface 27MHz 3.3V 450mW Tray 32-Pin HVQFN EP
欧州RoHS | Compliant |
Part Status | Active |
HTS | 8542.39.00.60 |
Automotive | No |
PPAP | No |
Maximum Clock Frequency (MHz) | 27 |
Minimum Operating Supply Voltage (V) | 2.7 |
Maximum Operating Supply Voltage (V) | 5.5 |
Typical Operating Supply Voltage (V) | 3.3 |
Maximum Supply Current (mA) | 65 |
Maximum Power Dissipation (mW) | 450 |
Minimum Operating Temperature (°C) | -25 |
Maximum Operating Temperature (°C) | 85 |
Packaging | Tray |
Mounting | Surface Mount |
Package Height | 0.83 mm |
Package Width | 5 mm |
Package Length | 5 mm |
PCB changed | 32 |
Standard Package Name | QFN |
Supplier Package | HVQFN EP |
Pin Count | 32 |
Lead Shape | No Lead |
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Smart Card Interface 27MHz 3.3V 450mW Tray 32-Pin HVQFN EP
欧州RoHS | Compliant |
Part Status | Active |
HTS | 8542.39.00.60 |
Automotive | No |
PPAP | No |
Maximum Clock Frequency (MHz) | 27 |
Minimum Operating Supply Voltage (V) | 2.7 |
Maximum Operating Supply Voltage (V) | 5.5 |
Typical Operating Supply Voltage (V) | 3.3 |
Maximum Supply Current (mA) | 65 |
Maximum Power Dissipation (mW) | 450 |
Minimum Operating Temperature (°C) | -25 |
Maximum Operating Temperature (°C) | 85 |
Packaging | Tray |
Mounting | Surface Mount |
Package Height | 0.83 mm |
Package Width | 5 mm |
Package Length | 5 mm |
PCB changed | 32 |
Standard Package Name | QFN |
Supplier Package | HVQFN EP |
Pin Count | 32 |
Lead Shape | No Lead |
注目の製品