欧州RoHS | Compliant |
ECCN (US) | 3A991.b.1.a |
Part Status | Active |
HTS | 8542.32.00.71 |
Automotive | No |
PPAP | No |
Cell Type | SLC NAND |
Chip Density (bit) | 1G |
Architecture | Sectored |
Boot Block | No |
Block Organization | Symmetrical |
Address Width (bit) | 28 |
Sector Size | 128Kbyte x 1024 |
Page Size | 2Kbyte |
Number of Bits/Word (bit) | 8 |
Number of Words | 128M |
Programmability | Yes |
Timing Type | Asynchronous |
Maximum Erase Time (s) | 0.01/Block |
Maximum Programming Time (ms) | 0.7/Page |
Interface Type | Parallel |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Maximum Operating Supply Voltage (V) | 1.95 |
Programming Voltage (V) | 1.7 to 1.95 |
Operating Current (mA) | 25 |
Program Current (mA) | 25 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Command Compatible | No |
ECC Support | Yes |
Support of Page Mode | No |
Minimum Endurance (Cycles) | 100000 |
Packaging | Tray |
Mounting | Surface Mount |
Package Height | 0.6 mm |
Package Width | 6.5 mm |
Package Length | 8 mm |
PCB changed | 48 |
Standard Package Name | BGA |
Supplier Package | VFBGA |
Pin Count | 48 |
Lead Shape | Ball |