Samsung Electro-MechanicsCL10Y225KA96PNC多层陶瓷电容器
Cap Ceramic 2.2uF 25V X7S 10% Pad SMD 0603 125°C Automotive T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8532.24.00.20 | |
| Automotive | Yes |
| PPAP | Unknown |
| 2.2uF | |
| 10% | |
| 25VDC | |
| X7S | |
| Standard | |
| Yes | |
| Flat | |
| Pad | |
| 2 | |
| N/R | |
| Ceramic Chip | |
| 1.6 X 0.8 X 0.8 | |
| 0603 | |
| -55 | |
| 125 | |
| Tape and Reel | |
| N/R | |
| 1.6 | |
| 0.8 | |
| 0.8 | |
| 0.0097 | |
| N/R |
| EDA / CAD Models |