Samsung Electro-MechanicsCL10Z475MQ9VPNC多层陶瓷电容器
Cap Ceramic 4.7uF 6.3V X7T 20% Pad SMD 0603 125°C Automotive T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8532.24.00.20 | |
| Automotive | Yes |
| PPAP | Unknown |
| 4.7uF | |
| 20% | |
| 6.3VDC | |
| X7T | |
| Soft Termination | |
| No | |
| AEC-Q200 Qualified | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 1.6 X 0.8 X 1 | |
| 0603 | |
| -55 | |
| 125 | |
| 1.6 | |
| 0.8 | |
| 1(Max) |
| EDA / CAD Models |