Samsung Electro-MechanicsCL21A226KOQNNNE多层陶瓷电容器
Cap Ceramic 22uF 16V X5R 10% Pad SMD 0805 85°C T/R
| Compliant | |
| EAR99 | |
| NRND | |
| 8532.24.00.20 | |
| Automotive | No |
| PPAP | No |
| 22uF | |
| 10% | |
| 16VDC | |
| X5R | |
| Standard | |
| Yes | |
| Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| N/R | |
| Ceramic Chip | |
| 10 | |
| 2 X 1.25 X 1.25 | |
| 0805 | |
| -55 | |
| 85 | |
| Tape and Reel | |
| N/R | |
| 2 | |
| 1.25 | |
| 1.25 | |
| 0.0209 | |
| N/R | |
| ±0.15 | |
| ±0.15 | |
| ±0.15 | |
| N/R |
| EDA / CAD Models |