Samsung ElectronicsCL31A107MQHNNNE多层陶瓷电容器
Cap Ceramic 100uF 6.3V X5R 20% Pad SMD 1206 85°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| 100uF | |
| 20% | |
| 6.3VDC | |
| X5R | |
| Standard | |
| No | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 10 | |
| 3.2 X 1.6 X 1.6 | |
| 1206 | |
| -55 | |
| 85 | |
| Tape and Reel | |
| 3.2 | |
| 1.6 | |
| 1.6 | |
| 0.0456 | |
| ±0.2 | |
| ±0.2 | |
| ±0.2 |
| EDA / CAD Models |