AIROC™ CYW5557x with Laird Sona™ IF573 WiFi 6E + Bluetooth® 5.4 Module
AIROC™ CYW5557x Wi-Fi 6E tri-band and Bluetooth® 5 SoCs
![AIROC CYW5557X WiFi 6E tri-band](https://static4.arrow.com/-/media/Arrow/Images/Miscellaneous/a/AIROC%20CYW5557X%20WiFi%206E%20tri-band.png)
Infineon’s AIROC™ CYW5557x is a highly integrated Wi-Fi 6 / 6E and Bluetooth® 5.3 SoC family. Supporting Wi-Fi 6 / 6E features with Tri-band (2.4GHz, 5GHz, 6GHz) capability, the CYW5557x is available in both 1x1 single-input, single-output (SISO) and 2x2 multiple-input, multiple-output (MIMO) configurations. The SoC brings exceptional high-quality video/audio streaming and a seamless gaming experience in congested network environments and significantly reduces latency by operating in the 6G spectrum.
This chip provides the technical benefits of Wi-Fi 6 – including increased communications range and robustness as well as increased battery life. It is also the first IoT Wi-Fi chip with Wi-Fi 6E support, allowing leading products access to the uncongested 6 GHz spectrum.
Key benefits
- Extreme low latency from greenfield 6 GHz bands and virtual simultaneous dual band feature for seamless audio and video streaming
- Range boost to ensure devices stay connected to remote access point
- Enhanced network robustness features to ensure the best streaming of video/audio in congested or overlapping network environments
- Advanced power saving features to maximize battery life
- Network offload to offload host processing power and save system power consumption
- Multi-layer security for protection of individual subsystems through whole product life-cycle
- Best-in-class Bluetooth® receive sensitivity and multiple optimized transmission options of 0 dbm, 13dbm, and 20dbm of output power for various applications
- AIROC™ Bluetooth® Stack and example code to shorten Bluetooth® development cycle
- Shorten time-to-market with globally certified module partners
- Wi-Fi support in the Infineon Developer Community with direct access to online applications support engineers
Applications
- Surveillance camera
- Smart speaker
- Voice assistance system
- AR/VR
- Digital camera
- Security system
- Industrial gateway
- AI enabled applications
- Gaming
Wi-Fi Features
- Wi-Fi 6/6E, Tri-band (2.4/5/6 GHz)
- OFDMA, MU-MIMO, TWT, DCM
- 2x2 MIMO or 1x1 SISO
- 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate
- STA and Soft AP mode
- Enhanced range, power savings, network efficiency features
- Zero-wait TWT
Bluetooth® Features
- Bluetooth® 5.3 certified
- Bluetooth® 5.2, 5.1, 5.0: All optional features
- LE Audio and Auracast™ Broadcast Audio
- LE- 2Mbps, Long Range , Advertising Extensions
- SCO and eSCO
- Complies with Bluetooth® core specification version 5.2
- 20 dBm, 13 dBm, and 0 dBm TX path to optimize range and/or minimize power consumption
- Best in class receive sensitivity up to -110.5 dBm
Coexistence
- Built-in advanced Bluetooth/WLAN Coex
- 2-wire SECI for external Coex
- Bluetooth/GPS/LTE radio
Laird Sona™ IF573 WiFi 6E + Bluetooth® 5.4 Module
![Laird Sona IF573 WiFi 6E and Bluetooth 54 Module](https://static4.arrow.com/-/media/Arrow/Images/Miscellaneous/l/Laird%20Sona%20IF573%20WiFi%206E%20and%20Bluetooth%2054%20Module.png)
Details:
- Wireless Specification: 2x2 Wi-Fi 6E and 1x1 Bluetooth 5.4
- Frequency: 2.4, 5, and 6 GHz (up to 7.125 GHz)
- Chipset: Infineon AIROC™ CYW55573
- Antenna options: RF Antenna Pin / On-board MHF4 Connector
- Certifications: FCC, IC, CE, MIC, RCM, Bluetooth SIG
- Data Rate: Up to 574 Mbps @ 2.4 GHz; Up to 1.2 Gbps @ 5/6 GHz
- Form Factors: M.2 1318 SMT & M.2 2230 Key E Pluggable
- Interfaces: PCIE v3.0 Gen 2 (Wi-Fi) and HCI using HS-UART (BT); SDIO 3.0 (Wi-Fi) and HCI using HS-UART (BT)
- Operating Temp: -40 °C - +85 °C
Laird Development Kit, Sona IF573
![Laird Development Kit Sona IF573](https://static4.arrow.com/-/media/Arrow/Images/Miscellaneous/l/Laird%20Development%20Kit%20Sona%20IF573.png)
The Sona IF573 Development Kit developed by Laird is designed for evaluation of the Sona IF573 module.
Features:
- MIMO, M.2, Key E, SDIO, UART
Embedded Artists 2EA M.2 Module Eval Board
![Embedded Artusts 2EA M2 Module Eval Board](https://static4.arrow.com/-/media/Arrow/Images/Miscellaneous/e/Embedded%20Artusts%202EA%20M2%20Module%20Eval%20Board.png)
The 2EA M.2 module, co-developed by Embedded Artists and Murata, is designed for evaluation, integration, and ease-of-use. The integration guide helps integrate an M.2 module into embedded designs and contains information about the M.2 standard and reference schematics.
Features
- Wi-Fi 6E, 802.11 a/b/g/n/ac/ax 2x2 MIMO
- Bluetooth® 5.2 BR/EDR/LE
- PCIe interface, in M.2 form factor (22 x 44 mm)
- Chipset: Infineon AIROC™ CYW55573
Murata Type 2EA Module for AIROC™ CYW55573
![Murata Type 2EA Module for AIROC](https://static4.arrow.com/-/media/Arrow/Images/Miscellaneous/m/Murata%20Type%202EA%20Partner%20Module%20for%20AIROC.png)
Details
- Part number: LBEE5XV2EA-802
- Wi-Fi/Bluetooth® Support: 2.4/5 and 6 GHz, 802.11a/b/g/n/ac/ax MIMO, Bluetooth®/Bluetooth® LE
- WLAN Stream: 2T2R
- Area: 12.5x9.4
- Regulatory: CE/FCC/IC/TELEC
- Linux: yes
- Interfaces: WLAN - PCIe/SDIO; Bluetooth®: UART/PCM
- Highlights: 2x2 MIMO 11ac + Bluetooth® solution (Bluetooth® 5.3) Support Wi-Fi 6E (6 GHz), -40°C to +85°C"
Featured Webinar
- Addressing IoT Connectivity Challenges with Enhanced Solutions for Wi-Fi 6/6E – TechOnline
- Exceed Your Industrial And Medical Connectivity Capabilities With Innovative WiFi 6/6E Solutions - 1631065 (webcasts.com)
Additional Resources
Linux WiFi Driver Releases on Infineon Developer Community |