| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.31.00.60 |
| Automotive | No |
| PPAP | No |
| Family Name | MAX 10 |
| User I/Os | 112 |
| Process Technology | 55nm |
| Shift Registers | Utilize Memory |
| Operating Supply Voltage (V) | 1.2 |
| Logic Elements | 4000 |
| Number of Multipliers | 20 (18x18) |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 189 |
| Device Logic Units | 4000 |
| Number of Global Clocks | 20 |
| Device Number of DLLs/PLLs | 2 |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| In-System Programmability | Yes |
| Speed Grade | 8 |
| Differential I/O Standards | HSUL|LVDS|SSTL |
| External Memory Interface | DDR2 SDRAM|DDR3 SDRAM|DDR3L SDRAM|LPDDR2 SDRAM |
| Minimum Operating Supply Voltage (V) | 1.15 |
| Maximum Operating Supply Voltage (V) | 1.25 |
| I/O Voltage (V) | 1.2|1.35|1.5|1.8|2.5|3|3.3 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tray |
| Mounting | Surface Mount |
| Package Height | 0.68 |
| Package Width | 8 |
| Package Length | 8 |
| PCB changed | 153 |
| Standard Package Name | BGA |
| Supplier Package | MBGA |
| Pin Count | 153 |
| Lead Shape | Ball |
