| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.36 |
| Automotive | Yes |
| PPAP | Yes |
| DRAM Type | Mobile LPDDR4 SDRAM |
| Chip Density (bit) | 8G |
| Organization | 256Mx32 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 32M |
| Number of Bits/Word (bit) | 32 |
| Data Bus Width (bit) | 32 |
| Maximum Clock Rate (MHz) | 3200 |
| Address Bus Width (bit) | 18 |
| Process Technology | CMOS |
| Interface Type | LVSTL |
| Minimum Operating Supply Voltage (V) | 1.06|1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.17|1.95 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Automotive |
| Number of I/O Lines (bit) | 32 |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) |
| Package Width | 10 |
| Package Length | 14.5 |
| PCB changed | 200 |
| Standard Package Name | BGA |
| Supplier Package | TFBGA |
| Pin Count | 200 |
