| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| HTS | 8541.29.00.75 |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| Configuration | Dual Common Source |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 2 |
| Mode of Operation | Pulse |
| Process Technology | LDMOS |
| Maximum Drain Source Voltage (V) | 120 |
| Maximum Gate Source Voltage (V) | 10 |
| Maximum Gate Threshold Voltage (V) | 3 |
| Maximum VSWR | 10 |
| Maximum Gate Source Leakage Current (nA) | 10000 |
| Maximum IDSS (uA) | 100 |
| Typical Input Capacitance @ Vds (pF) | 506@50V |
| Typical Reverse Transfer Capacitance @ Vds (pF) | 3.3@50V |
| Typical Output Capacitance @ Vds (pF) | 147@50V |
| Maximum Power Dissipation (mW) | 1333000 |
| Output Power (W) | 1000(Typ) |
| Typical Power Gain (dB) | 20 |
| Maximum Frequency (MHz) | 500 |
| Minimum Frequency (MHz) | 10 |
| Typical Drain Efficiency (%) | 64 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Operating Temperature (°C) | 150 |
| Packaging | Tape and Reel |
| Mounting | Screw |
| Package Height | 4.83(Max) mm |
| Package Width | 10.29(Max) mm |
| Package Length | 41.28(Max) mm |
| PCB changed | 5 |
| Supplier Package | NI-1230 |
| Pin Count | 5 |
