Winbond ElectronicsW71NW11GC1DWマルチチップパッケージメモリ
MCP 64Mx16 Flash + 32Mx16 DDR DRAM 1.8V 130-Pin VFBGA
| 3A991b.1.a. | |
| Unconfirmed | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 0.68 |
| Package Width | 8 |
| Package Length | 9 |
| PCB changed | 130 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| 130 |
| EDA / CAD Models |