| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.28 |
| Automotive | No |
| PPAP | No |
| DRAM Type | Mobile LPDDR2 SDRAM |
| Chip Density (bit) | 512M |
| Organization | 32Mx16 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 8M |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 400 |
| Maximum Access Time (ns) | 5.5 |
| Address Bus Width (bit) | 15 |
| Interface Type | HSUL_12 |
| Minimum Operating Supply Voltage (V) | 1.14|1.7 |
| Typical Operating Supply Voltage (V) | 1.2|1.8 |
| Maximum Operating Supply Voltage (V) | 1.3|1.95 |
| Operating Current (mA) | 175 |
| Minimum Operating Temperature (°C) | -25 |
| Maximum Operating Temperature (°C) | 85 |
| Number of I/O Lines (bit) | 16 |
| Mounting | Surface Mount |
| Package Height | 0.58 mm |
| Package Width | 10 mm |
| Package Length | 11.5 mm |
| PCB changed | 134 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| Pin Count | 134 |
| Lead Shape | Ball |
