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사용자 정의 열

• Manufacturer
• Category
• 주식
• Type
• Main Category
• Flash Memory Size - (bit)
• Density - (bit)
• Cell Type
• Category
• Subcategory
• SRAM Memory Size - (bit)
• ECC Type
• Density in Bits - (bit)
• Total Density
• Organization
• Internal Memory Size
• Architecture
• Programmability
• Number of Bits per Word - (bit)
• Flash Maximum Access Time - (ns)
• External Memory
• Configuration
• Boot Block
• Reprogramming Technique
• Number of Internal Banks
• Module Type
• Data Retention - (Year)
• Block Organization
• Number of Words per Bank
• Number of Chip per Module
• Location of Boot Block
• Data Rate Architecture
• Bus Directional
• Timing Type
• Minimum Operating Supply Voltage - (V)
• Maximum Operating Frequency - (MHz)
• Data Bus Width - (bit)
• Chip Density - (bit)
• Address Width - (bit)
• Number of Ports
• Maximum Clock Rate - (MHz)
• Number of Words
• Maximum Access Time - (ns)
• Interface Type
• In-System Programmability
• Process Technology
• Address Bus Width - (bit)
• Chip Configuration
• Chip Package Type
• Maximum Operating Current - (mA)
• Maximum Operating Supply Current - (mA)
• Maximum Operating Supply Voltage - (V)
• Hardware Data Protection
• Expansion Support
• Supplier Temperature Grade
• ECC Support
• Number of Ranks
• CAS Latency
• Packaging
• Rad Hard
• Pin Count
• Supplier Package
• Standard Package Name
• CECC Qualified
• ESD Protection
• ESCC Qualified
• Military
• AEC Qualified
• AEC Qualified Number
• Auto motive
• P PAP
• ECCN Code
• SVHC
• SVHC Exceeds Threshold

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