Residential Heat Pump – Infineon’s Solution Offering

Smart residential heat pump systems with sensing, control, and connectivity

The first heat pump was installed in the first half of the 20th century. So, the concept of using energy from the environment to heat and cool is nothing new. But modern heat pumps are much more efficient, smaller, and of course smarter than its predecessors. With the commitment to reducing CO2 emissions, traditional heating systems like gas and oil boilers must be replaced with more sustainable ones such as heat pumps.

Heat pumps use a motor drive that operates a compressor to convert electricity into heat in the vapor-compression cycle. The heat from the environment is transferred to the refrigerant cycle using a fan (air type) or a pump (water and ground type). To make use of that heat, a heat exchanger transfers it to the hydronic heating system via a circulation pump. All components, circulation pump, fan, and compressor, are operated by a motor drive to increase energy efficiency and reduce losses. Furthermore, the heat pump is connected to the smart home and can be easily controlled via a touch screen. Connectivity, both to the smart home and the internet, will play an important role in enabling the energy transition. Using the heat pump to store energy via the water tank is an important method of balancing loads and saving money. Our solutions bring more intelligence and efficiency to modern heat pumps: Achieve the highest efficiency levels and the smallest form factors using our smartest power designs. We offer a comprehensive portfolio of single- and three-phase solutions across all power classes, making it easy for you to choose the most suitable solution for your heat pump.

Monobloc system

Featured products

CIPOS™ IPMs and Easy and Econo modules are the best solutions for highly integrated compressor drives. Discrete solutions such as our Discrete IGBT are the best choice when layout flexibility and thermal performance optimization are your major concern. They can all be combined with iMOTION™ motor controllers with its code-free Motion Control Engine, containing the relevant algorithms for heat pumps such as high-pressure start-up and vibration suppression at low speed. EiceDRIVER™ gate driver ICs offer a comprehensive product portfolio with a variety of configurations to drive a broad range of power switches (IGBTs, MOSFETs, SiC MOSFETs, and GaN HEMTs). Power Factor Correction (PFC) is another important building block to increase efficiency. Again, we offer you all design degrees of freedom with it IGBTs, diodes, EiceDRIVER™ gate driver ICs, CIPOS™ IPMs and Easy Modules.

The combination of PSoC™ microcontrollers for system control, AIROC™ Wi-Fi & BT Combo products, and XENSIV™ sensors enable highly innovative and easy-to-design systems with a rich user interface. For the auxiliary power supply, the CoolSET™ rounds up our power portfolio by offering increased robustness and performance.

  • IMC302AF064XUMA1 – High Performance Motor Control IC to drive compressor and fan without any coding
  • IMI111T026HXUMA1 – Triple Half Bridge Motor Controller and Driver 3.3V 22-Pin DSO for fan or pump control without any coding
  • FP25R12W1T7B11BPSA1 – Trans IGBT Module N-CH 1200V 25A 23-Pin Tray for the power stage of the compressor
  • 2ED2181S06FXUMA1 – 650 V Half Bridge Gate Driver with integrated bootstrap diode to drive power modules
  • 2EDL23I06PJXUMA1 – Driver 0.70A 2-OUT High and Low Side Half Brdg Non-Inv 14-Pin DSO T/R to drive power modules
  • 2ED1322S12MXUMA1 – Driver 4.6A 2-OUT High Side Half Brdg Non-Inv T/R to drive power modules
  • ICE5QR2280BGXUMA1 – AC to DC Switching Converter Flyback 10.5V T/R 12-Pin DSO for auxiliary power supply
  • IKW40N65WR5XKSA1 – Trans IGBT Chip N-CH 650V 80A 230W 3-Pin(3+Tab) TO-247 Tube
  • CY8C4125AXI-483 – MCU 32-bit ARM Cortex M0 RISC 32KB Flash 2.5V/3.3V/5V 44-Pin TQFP Tray

Presentation: Heat pumps: Market and technology overview

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Webinar: Heat pumps: Market and technology overview

Training: Learn about residential heat pumps

Webinar: Advanced semiconductor solutions for a hot future in heat pumps

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