Samsung ElectronicsCL10A106KP8NNNC多层陶瓷电容器
Cap Ceramic 10uF 10V X5R 10% Pad SMD 0603 85°C T/R
| Compliant | |
| EAR99 | |
| Active | |
| 10uF | |
| 10% | |
| 10VDC | |
| X5R | |
| Standard | |
| No | |
| Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | |
| Flat | |
| Surface Mount | |
| Pad | |
| 2 | |
| Ceramic Chip | |
| 0.1 | |
| 1.6 X 0.8 X 0.8 | |
| 0603 | |
| -55 | |
| 85 | |
| Tape and Reel | |
| 1.6 | |
| 0.8 | |
| 0.8 | |
| ±0.1 | |
| ±0.1 | |
| ±0.1 |
| EDA / CAD Models |