Intel leading edge programmable solutions

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Overview

Accelerate innovation with a comprehensive suite of innovative FPGA products unified by a single architecture, enhanced by Intel’s design, software, and manufacturing leadership, with optimizations across all levels of performance, power efficiency, and form factor to address a wide breadth of workloads. Intel® FPGAs offer a wide variety of configurable embedded SRAM, high-speed transceivers, high-speed I/Os, logic blocks, and routing. Built-in intellectual property (IP) combined with outstanding software tools lower FPGA development time, power, and cost.

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Intel® Agilex™ FPGA Product Families

Description Series
intel-agilex-9-logo
Pushing beyond the limits of mainstream programmable logic — these FPGAs provide unprecedented capabilities and optimization for their target applications Direct RF-Series
intel-agilex-7-logo
Highest performance FPGAs delivering industry-leading fabric and IO speeds, ideal for the most bandwidth and compute-intensive applications
M-Series
I-Series
F-Series
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Midrange FPGAs optimized for applications requiring high performance, lower power, and smaller form factors
D-Series
E-Series
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Power and cost-optimized FPGAs in compact form factors — essential building blocks targeted for a wide range of applications across many markets Coming Soon

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Arrow Electronics is providing a full featured development kit with the latest Intel® Agilex™ 5 E-series SoC FPGA (codename Sundance Mesa) and supports customers already in early developments stages.

Intel® Agilex™ 5 E-series is manufactured on Intel 7 technology and delivering excellent performance-per-watt, delivering low power and smaller form factors for midrange FPGA applications. Logic sizes are from 50k to 656k LEs and scalable via various packages, down to 15mm x 15mm. Intel Agilex™ 5 devices also feature the industry’s first Enhanced DSP with AI Tensor Block, which deliver high-efficiency AI and DSP functionality, and the FPGA industry’s first asymmetric applications processor system consisting of dual Arm CortexA76 cores and dual Cortex-A55 cores, for performance and power efficiency of their workloads. In addition, the FPGAs offer advanced features such as a second-generation Intel® Hyperflex™ FPGA Architecture, high-speed transceivers support up to 28.1 Gbps (17Gbps on Devkit), and PCIe 4.0 x8, hard memory controller DDR4 and LPDDR4/5, and general purpose I/O from 1.05 V to 3.3 V. These characteristics are ideal for midrange FPGA applications across the edge and core including wireless and wireline communications, video and broadcast equipment, industrial applications, test and measurement products, medical electronics, data center and defense applications.

Arrow’s Devkit enables customers to evaluate the features of Agilex™ 5 E and speed up development. With the FMC and CRUVI LS/HS connectors, various adapter boards can be connected, to create further applications. Arrow will provide software and Linux support for the Devkit. And it features the Arrow USB Programmer2 for debugging and programming. The board can also be modified and redesigned for customized versions on request.

Key Features: Arrow Agilex™ 5 Devkit – AXE5-Eagle

  • A5E 043B - 434 kLE (ES: A5E 065B - 656kLE)
  • SoC: Dual Core A55 + Dual Core A76
  • BBGA 1596 (32x32)
  • LPDDR4: 2x 8Gbit x32
  • 1Gbit SPI Flash
  • MicroSD card
  • HDMI
  • USB 3.x
  • 2x 1GBit Ethernet
  • EEPROM
  • PCIe 4.0 x4 edge connector
  • FMC+ connector (8x TX/RX @17Gbps)
  • 2x SFP+ connector for 10GBit
  • 2x CRUVI LS/HS for additional adapter & interface boards
  • Power supply: 12V adapter
  • Size: ~18x18cm²
  • Arrow USB Programmer2 (debug, programming)


Partners

Intel Trenz Electronic Molex Analog Devices Micron Skyworks Samtec APX

0124-TEI0185-01


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Roadshows & Webinars

Arrow Intel FPGA Roadshow

Intel roadshow:

North America

9/12/2023- Parsippany, NJ

9/12/2023- Dallas

9/13/2023- Toronto

9/13/2023- Phoenix

9/13/2023- Baltimore

9/19/2023- Austin

9/20/2023- Seattle

9/20/2023- Montreal

9/27/2023- Western Canada (Burnaby, BC)

10/5/2023 Portland

10/11/2023- San Jose

10/19/2023- Boston

10/25/2023- Connecticut

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Central Europe:

6/13/2023- München

6/14/2023- Freiburg

6/14/2023- Wien

6/20/2023- Dortmund

6/21/2023- Braunschweig

6/21/2023- Stuttgart

6/22/2023- Frankfurt

6/27/2023- Hamburg

6/28/2023- Berlin

6/28/2023- Zürich

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Nordic

6/6/2023- Oslo

6/7/2023- Copenhagen

6/13/2023- Stockholm

6/14/2023- Helsinki

6/21/2023- Tallinn

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France

6/14/2023- Rennes

6/22/2023- Paris

7/4/2023- Lyon

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Iberia

6/21/2023- San Sebastian

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UK/Benelux

Reading, UK

Leeds, UK

Diegem, Belgium

Utrecht, Netherlands

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EEM

6/14/2023- Ankara, Turkey

6/26/2023- Warsaw, Poland

6/27/2023- Budapest, Hungary

6/28/2023- Prague, Czech Republic

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Italy

6/22/2023- Bologna

6/27/2023- Milano

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Samtec and Arrow Partner on New Intel® Agilex™ 5 E-series SoC Dev Kit

Learn more about how Samtec and Arrow have partnered with Intel® to bring increased computational capabilities to the intelligent edge.

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Benefits of Adopting the Latest in EV DC Fast-Charging Technology

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Data Sheet

Reference Designs

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