Octavo Systems is leading the System-in-Package (SiP) revolution. Our goal is to make the electronic design process as easy as possible by integrating the most common components of an embedded system into a single, easy to use, IC package. Our solutions combine components like Microprocessors, Memory, Power Supplies, and much more form the largest component providers into system level building blocks. Our SiP devices remove the tedious parts from designing electronic systems and allow you to focus on your differentiating features. Octavo Systems’ System-in-Package solutions will enable you to create smaller designs, faster, and at a lower cost.

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