The industrial landscape is changing – and that provides an opportunity for designers to use best-of-breed connectors to enable their IIoT devices. Learn how to make better design decisions by choosing the right connectors, power sources, and design flexibility to maximize your product’s staying power.
The industrial internet of things (IIoT) is creating opportunities for people to utilize complex analytics and insights to make better real-time decisions and deploy powerful predictive analytics to address problems before they become a crisis.
The number of connected devices on the internet reached 26.66 billion in 2019, according to a Leftonic article, “IoT Statistics and Trends to Know in 2020,” and 127 new IoT devices are connecting to the web every second. And the size of the IoT market will reach $520 billion in 2021.
No doubt, across industries, the IIoT gives users information that drives results and creates change.
More Modularity in a Smaller Space
With such vast opportunity, many users face roadblocks as they try to bring together disparate devices and systems, and need a better way to integrate devices, applications, and systems to maximize the benefits of connectivity.
The next wave of features propelled by IIoT innovation will require increased internal PCB and flex assembly density within the same application profile. This will drive more modularity, with complex circuitry requiring additional semiconductors, memory, capacitors, and resistors on multiple boards, increasing low-profile connector demand.
Assemblies will demand connectors with improved signal integrity (SI) for speed and robustness in tight spaces. And while connectivity is increasing, it must be accomplished without an increase in the product profile.
The ability of systems to orchestrate the automation of disparate information – for example, audio/video, security cameras and access systems – dramatically increases the modulatory in these applications. In turn, this increases demand for high-performing connection points.
The rise of complex electronic connections has created major trends in application design for any device that will enable the IIoT.
TREND 1: More Features Need More Power
Feature-rich devices require more power in the same space, demanding low-to-mid power connections.
At the same time, the demand for space savings with increased internal density will drive shifts from wire-to-board or flex-to-board in how the power is supplied into the board.
Power Board-to-Board Connectors use a dual-contact terminal design for signal assurance during shocks and vibration, and a wraparound nail design provides additional mechanical robustness.
Molex’s Nano-Fit Power Connectors are fully isolated terminals with 6.5 to 8.0A current ratings and a 2.50mm pitch and offer an optional terminal position assurance retainer.
TREND 2: Real-Time Information Requires Faster Connections
Everything, from sensors to cameras, is processing and interpreting more information at higher processing speeds, requiring connectors with superior SI performance. This will require designers to consider high-performing, durable interconnects early in the development process. While higher-resolution displays require increased EMI and SI performance, antenna bands have evolved to drive more information at higher processing speeds, requiring more active and passive components.
Molex Pico-Lock Wire-to-Board Connectors offer a side positive locking system for high retention force and maximum space savings, with an ultra-low-profile right-angle design and up to 3.5A per circuit design.
As a solution, Micro-Lock Plus Wire-to-Board Connectors offer design flexibility with multiple pitches, mating orientations, dual-and single-row options, and a robust low-profile mechanical locking system for optimal retention force.
TREND 3: Space Constraints Require Profile Flexibility
The inside profiles of most applications are becoming more space constrained. Increased modularity limits the space from the connector and other components, requiring more profile and orientation micro connector options. Having multiple profile and orientation micro connector options gives designers flexibility to address space, location and connector entry-point challenges.
Molex’s SlimStack FSB5 Floating Board-to-Board Connectors have +/- 0.5mm of floating range in any direction for ease of mating and superior performance in high shock and vibration environments. Offered in multiple mating heights, they accommodate a high operating temperature and support up to 6 Gbps.
Easy-On 0.5mm-Pitch FPC Connectors offer multiple orientations, including vertical and right angle, and a large range of actuator styles for design flexibility and robustness.
Better Information, Better Decisions
The industrial landscape is changing – and that provides an opportunity for designers to use best-of-breed connectors to enable their IIoT devices.
From buildings to human bodies, using advanced analytics allows decision-makers, users and providers to maximize benefits and respond to opportunities in real time.
That could mean that your smart toothbrush tells you when it’s time to visit your dentist; your refrigerator tells you when you are running low on milk; and/or your smart watch tells you when it’s time to talk to your doctor.
Choose the Right Connector for Seamless Building Integration
Molex’s high-speed solution supports the SI margins for sensors, cameras, HMI and system communications. Molex engineers are driving microminiature innovations for customers and designers who need space savings, high-density signals and durability in connector designs.
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