| 欧州RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | NRND |
| HTS | 8542.32.00.32 |
| Automotive | No |
| PPAP | No |
| DRAM Type | DDR RLDRAM3 |
| Chip Density (bit) | 576M |
| Organization | 16Mx36 |
| Number of Internal Banks | 16 |
| Number of Words per Bank | 1M |
| Number of Bits/Word (bit) | 36 |
| Data Bus Width (bit) | 36 |
| Maximum Clock Rate (MHz) | 1066 |
| Maximum Access Time (ns) | 10 |
| Address Bus Width (bit) | 23 |
| Process Technology | CMOS |
| Minimum Operating Supply Voltage (V) | 1.28|2.38 |
| Typical Operating Supply Voltage (V) | 1.35|2.5 |
| Maximum Operating Supply Voltage (V) | 1.42|2.63 |
| Operating Current (mA) | 1835 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Industrial |
| Number of I/O Lines (bit) | 36 |
| Mounting | Surface Mount |
| Package Height | 0.68(Min) |
| Package Width | 13.5 |
| Package Length | 13.5 |
| PCB changed | 168 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 168 |
| Lead Shape | Ball |
