Samsung Electronics K4A8G165WC-BCRC DRAMチップ
DRAM Chip DRAM 8Gbit 512Mx16 1.2V 96-Pin FBGA

DRAM Chip DRAM 8Gbit 512Mx16 1.2V 96-Pin FBGA
欧州RoHS | Supplier Unconfirmed |
ECCN (US) | EAR99 |
Part Status | Obsolete |
HTS | 8542.32.00.36 |
Automotive | No |
PPAP | No |
DRAM Type | DRAM |
Chip Density (bit) | 8G |
Organization | 512Mx16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 2400 |
Typical Operating Supply Voltage (V) | 1.2 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 85 |
Number of I/O Lines (bit) | 16 |
Mounting | Surface Mount |
Package Width | 7.5 |
Package Length | 13.3 |
PCB changed | 96 |
Standard Package Name | BGA |
Supplier Package | FBGA |
Pin Count | 96 |
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DRAM Chip DRAM 8Gbit 512Mx16 1.2V 96-Pin FBGA
欧州RoHS | Supplier Unconfirmed |
ECCN (US) | EAR99 |
Part Status | Obsolete |
HTS | 8542.32.00.36 |
Automotive | No |
PPAP | No |
DRAM Type | DRAM |
Chip Density (bit) | 8G |
Organization | 512Mx16 |
Data Bus Width (bit) | 16 |
Maximum Clock Rate (MHz) | 2400 |
Typical Operating Supply Voltage (V) | 1.2 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 85 |
Number of I/O Lines (bit) | 16 |
Mounting | Surface Mount |
Package Width | 7.5 |
Package Length | 13.3 |
PCB changed | 96 |
Standard Package Name | BGA |
Supplier Package | FBGA |
Pin Count | 96 |
注目の製品