Samsung Electro-Mechanics 콘덴서 세라믹 다층기
| 부품 번호 | Price | 주식 | Manufacturer | Category | Capacitance Value | Tolerance | Voltage | Dielectric | Technology | Special Features | Construction | Termination Style | Terminal Pitch - (mm) | Case Style | Package/Case | Operating Temperature - (°C) | Size - (mm) | Packaging | Maximum Dissipation Factor - (%) | Equivalent Series Resistance Type | Rad Hard | CECC Qualified | ESD Protection | Military | AEC Qualified | AEC Qualified Number | Auto motive | P PAP | ECCN Code | SVHC | SVHC Exceeds Threshold |
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CL10B222KB8NCNC
Cap Ceramic 0.0022uF 50V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 0.0022uF | 10% | 50VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | No | No | No | No | EAR99 | No | No | ||||||||
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CL10B331JB8NNNC
Cap Ceramic 330pF 50V X7R 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 330pF | 5% | 50VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | No | No | No | No | EAR99 | No | No | ||||||||
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CL10B471KB8NNNL
Cap Ceramic 470pF 50V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 470pF | 10% | 50VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | No | No | No | No | EAR99 | No | No | ||||||||
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CL10B472KB85PNC
Cap Ceramic 0.0047uF 50V X7R 10% Pad SMD 0603 OMD-CAP 125°C T/R Automotive AEC-Q200
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 0.0047uF | 10% | 50VDC | X7R | Open Mode | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | ||||||||
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CL10C140JB8NNNC
Cap Ceramic 14pF 50V C0G 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 14pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL10C131JB8NNNC
Cap Ceramic 130pF 50V C0G 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 130pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL10C150JB8NNND
Cap Ceramic 15pF 50V C0G 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 15pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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인기 검색어
CL10B104KB8NNNC
Cap Ceramic 0.1uF 50V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 0.1uF | 10% | 50VDC | X7R | Standard | Highly Reliable Performance|Highly Reliable Tolerance and High Speed Automatic Chip Placement on PCBs|Wide Capacitance Range | Flat | Pad | N/R | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | Low | Yes | No | No | No | No | EAR99 | No | No | |||||
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CL21A475KQCLNNC
Cap Ceramic 4.7uF 6.3V X5R 10% Pad SMD 0805 85°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 4.7uF | 10% | 6.3VDC | X5R | Standard | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.85 | Tape and Reel | 10 | No | No | No | No | EAR99 | No | No | ||||||||
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CL05B473KO5NNWC
Cap Ceramic 0.047uF 16V X7R 10% Pad SMD 0402 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 0.047uF | 10% | 16VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | 3.5 | No | No | No | No | NLR | No | No | ||||||||
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CL21B223KB6WPNC
Cap Ceramic 0.022uF 50V X7R 10% Pad SMD 0805 OMD-CAP 125°C T/R Automotive AEC-Q200
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 0.022uF | 10% | 50VDC | X7R | Open Mode | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.6 | Tape and Reel | 3 | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | |||||||
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CL21B472KCANNND
Cap Ceramic 0.0047uF 100V X7R 10% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 0.0047uF | 10% | 100VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.65 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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구매 최고 구매자
CL21B104KCC5PNC
Cap Ceramic 0.1uF 100V X7R 10% Pad SMD 0805 OMD-CAP 125°C T/R Automotive AEC-Q200
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 0.1uF | 10% | 100VDC | X7R | Open Mode | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.85 | Tape and Reel | 2.5 | Low | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | ||||||
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CL21C120JBANNNC
Cap Ceramic 12pF 50V C0G 5% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 12pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.65 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL21C121JDCNNNC
Cap Ceramic 120pF 200V C0G 5% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 120pF | 5% | 200VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 0805 | 2 X 1.25 X 0.85 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL31C101JJHNNNE
Cap Ceramic 100pF 2000V C0G 5% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | Yes | No | No | No | No | EAR99 | No | No | ||||||||||||||||||||
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CL31C101JGFNNNF
Cap Ceramic 100pF 500V C0G 5% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 100pF | 5% | 500VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 1.25 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL31C270JBCNNNC
Cap Ceramic 27pF 50V C0G 5% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 27pF | 5% | 50VDC | C0G | Standard | High Reliability | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 0.85 | Tape and Reel | No | No | No | No | EAR99 | No | No | ||||||||
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CL31C271JBCNNNC
Cap Ceramic 270pF 50V C0G 5% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 270pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 0.85 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL31C271JGFNNNF
Cap Ceramic 270pF 500V C0G 5% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | No | No | No | No | EAR99 | No | No | |||||||||||||||||||||
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CL31C271KIHNNNF
Cap Ceramic 270pF 1000V C0G 10% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 270pF | 10% | 1000VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 1.6 | Tape and Reel | No | No | No | No | NLR | No | No | |||||||||
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CL31C330JHFNNNF
Cap Ceramic 33pF 630V C0G 5% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 33pF | 5% | 630VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 1.25 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL31C330JBCNNNC
Cap Ceramic 33pF 50V C0G 5% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 33pF | 5% | 50VDC | C0G | Standard | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 0.85 | Tape and Reel | No | No | No | No | EAR99 | No | No | |||||||||
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CL31A226MOHNNNE
Cap Ceramic 22uF 16V X5R 20% Pad SMD 1206 85°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 22uF | 20% | 16VDC | X5R | Standard | Flat | Pad | N/R | Ceramic Chip | 1206 | 3.2 X 1.6 X 1.6 | Tape and Reel | 10 | Yes | No | No | No | No | EAR99 | No | No | |||||||
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CL02B221KP2NNNC
Cap Ceramic 220pF 10V X7R 10% Pad SMD 01005 125°C T/R
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Samsung Electro-Mechanics | Capacitor Ceramic Multilayer | 220pF | 10% | 10VDC | X7R | Standard | Flat | Pad | N/R | Ceramic Chip | 01005 | 0.4 X 0.2 X 0.2 | Tape and Reel | 10 | No | No | No | No | EAR99 | No | No |