A safe, connected vehicle is accomplished with a telematics control unit (TCU). Analysts are predicting by 2020 globally there will be 220 million connected vehicles in total. The embedded telematics market is growing at an estimated 45% CAGR over the next five years. In addition, there is an aftermarket for connected telematics. An example of aftermarket telematics are insurance trackers and this segment is growing at a 34% CAGR (2014 to 2020).
Telematics use cases keeps evolving. Yesterday’s TCUs enabled better fleet management, automatic vehicle-initiated emergency calls, in-vehicle conference call service, concierge services, and car diagnostics such as vehicle health information to your local dealer or car manufacturer. Like any IoT connected device, the role for TCUs are expanding. For example, car manufacturers have begun sending over the air (OTA) software updates for vehicle electric control modules directly to connected vehicles. TCUs will continue to be the primary communication gateway enabling smarter cars, even without having to buy a new car. Nonvolatile, reprogrammable NAND flash memory can act as the interim storage location for the OTA software updates before it is sent to the appropriate in-vehicle electronic control module.
As more sensors are built into vehicles, motivated by safety reasons, these vehicles will collect massive amount of data, likely do some localize processing, and then send relevant information into cloud. The types of data collected will not be limited to vehicle-related information. These sensors will gather information on the entire surroundings (traffic, landscapes, and weather). This data gathering will enable services that are yet to be dream of. The two-way wireless communication combined with GPS, are two very important components and play an essential role for autonomous driving and to generate driver assisted augmented reality features, on displays such as a heads up display (HUD).
Most telematics units use technology adopted from feature phones, which includes a wireless gateway. Comparing the needs of a TCU to a smart phone, smart phones are designed for sending and receiving massive amounts of data 24/7 and recharged nightly. A TCU will typically send smaller amounts of data for many years and is powered by the vehicle. The high endurance, program and erase cycles, and densities of a NAND flash can meet the requirements for a vehicle in service for 10 to 15 years or even longer.
Winbond’s MCP (multichip package) devices include two low power devices, 1.8V, NAND and SDRAM, in a single package. This combination of memory types offer high performance for consumer and industrial applications that require a long-life, high endurance and data integrity. As a companion to the wireless modem chipset, Winbond’s MCP family of products are ideal for IoT devices at the edge, like a vehicle that need connectivity to the cloud.
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The W71NW MCP from Winbond showcases combined functionality in a single package. This memory product family combines a 1.8V NAND Flash Memory component with a 1.8V Low Power SDRAM device in a single, convenient VFBGA. The 1Gbit x16bit W29N01GW NAND Flash Memory device has 100k erase/program cycle endurance and offers 10 years of data retention. The 512Mbit low power W949D6KK DDR SDRAM has both a power down mode and a Deep Power Down (DPD) mode as well as clock stop capability during idle periods for maximum power savings. Partial Array Self Refresh (PASR) and Auto Temperature Compensated Self Refresh (ATCSR) capabilities optimize power during operation.
Together, these unique NAND and DDR SDRAM combination devices in a single package offer high-performance for consumer and industrial applications that require a long-life, high endurance and data integrity even under rugged conditions. The biggest advantage they offer is board area saving in space-constrained applications since they require only a single package instead of two packages.