Transportation applications have modularity challenges that require connectors to perform with improved signal integrity, speed, and robustness within compact and harsh environments. In this article, Molex explores how their micro connectors — including the Easy-On family, the SlimStack FSB5 Series, and the Micro-Lock Plus Wire-to-Board Connector System — create innovative solutions for the latest in transportation applications. Learn more about how Molex has continued to create premium solutions for the changing demands in transportation applications.
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Connectors for Modularity in Transportation Applications
As smart vehicles advance within the industry, automotive systems are becoming more connected than ever before. The rise of complex electronic connections has created three major trends in automotive application design: human machine interface (HMI) connections, design for harsh environments, and flexibility for constrained spaces.
TREND 1: HMI Connections
Automobile designers are striving to offer optimal in-vehicle communication experiences for drivers and passengers with LCD panels in steering wheels, center consoles, and seats. This requires equally optimal HMI connections. As most user interfaces have flex-to-board connection points, the requirement for devices to design in a flexible printed circuit board (PCB) or board-to-board (B-to-B) connector has increased. In addition, the demand for sensors, microphones, speakers and cameras is driving increased modularity. This requires more flexible printed circuits (FPC), flexible flat cables (FFC), B-to-B and wire-to-board (W-to-B) signal connections.
The Molex Easy-On family, including the FD19 series, offers a superior solution for car navigation, instrument panels, and car infotainment. This series offers a unique front flip actuator design with built-in retention features and durability through high shock and vibration.
TREND 2: Durability in Harsh Environments
Today’s vehicles demand greater reliability and functionality from its electronic connections. When considering factors such as temperature, vibration and fluid ingress, automotive electronics have a growing list of problems to combat — including early design and development for high-performing, durable interconnects. This is driving the need for better performing FPC, FFC, board-to-board and wire-to-board signal connections.
As a solution, Molex’s SlimStack 0.40mm-Pitch Floating Board-to-Board Connector (FSB5 Series) offers a +/- 0.5mm floating range in any direction. This provides ease of mating and superior performance in high shock and vibration environments. In addition, the FSB5 series offers the smallest size in the B-to-B floating connectors market, providing space saving for a multitude of applications.
TREND 3: Flexibility for Space Constrained Profiles
The demand is growing for smaller and higher performing product technology. Today’s transportation applications have increased modularity with limited space for connectors and other components.
Microminiature connectors, such as Molex’s Micro-Lock Plus Wire-to-Board Connector System, offer more profile and mating orientation options. Ideal for compact applications, this system provides electrical and mechanical reliability while meeting industry requirements for high-temperature design. Micro-Lock Plus is the smallest connector currently on the market with a positive lock for both compactness and retention security.
Choosing the Right Connector to Address Modularity Challenges
Discover a high-speed solution that supports the signal integrity (SI) margins for sensors, cameras, HMI, and system communications.Molex is on the frontline, driving microminiature innovations for customers and engineers who need space savings, high-density signals and durability in connector designs.