Six years into the future doesn’t seem very futuristic — yet in that brief timespan, the world is likely to witness several game-changing innovations in the datacom, transportation, energy and consumer connectivity industries. A recent Molex report, Predicting the Connectivity of Tomorrow, provides an in-depth look at the inspiring developments in electronics that are anticipated through the remainder of this decade.
The report showcases emerging applications like contactless connectivity and data transmission at twice the speeds we see today. It also highlights slim devices that forge new frontiers in miniaturization.
What will drive major trends in the development of interconnect solutions from now until 2030 — and how will engineers keep up with the rapidly evolving landscape of data, devices and infrastructure? Read on to learn about Molex’s innovative approach to connector design and the latest connector developments poised to enable the future.
The Art of Interconnectivity
Making a connector that can accommodate more power or data might sound like a simple feat. But like any other design challenge, interconnect technology involves trade-offs between variables that are often at odds with each other. For any connector, main variables include:
- Signal integrity and power quality
- Rate of data transfer and/or power rating
- Thermal management
- Form factor, size and weight
Augmenting one variable often amplifies deficiencies in others. Higher power applications, for example, force engineers to consider the extra thermal energy generated. Faster speeds through a cable or wireless device can result in more noise and less signal. Molex’s miniaturization focus offers a glimpse into the future of connector design — a future in which engineers balance heat, weight, power and data within ever-smaller form factors.
Trends Driving the Connector of the Future
How will connectors evolve over the remainder of this decade? Here are several market drivers likely to impact connector design, along with examples of related Molex innovations:
1. Faster data rates
The appetite for more and more data will be driven by surging consumer expectations, the growing prevalence of artificial intelligence (AI) and ever-evolving internet of things (IoT) applications. Pressure to increase data rates will be ongoing, particularly where bottlenecks are tightest — within data centers, near the edge or at points of transmission.
Increasing the data speeds that connectors and cabling can accommodate poses risks to signal integrity. A hybrid cable comprised of both fiber optics and copper wire is one Molex solution that helps address this conflict. Optical fibers transmit data signals while copper wires transmit power-optimizing speed over long distances. Other Molex optical connectivity solutions include:
- LC and Lc2+ adapters and cable assemblies, which meet growing demands for small form factor, high-density fiber optic connectivity with simplex, duplex, single-mode and multi-mode options
- Electromagnetic interference (EMI) shielding adapters, which help limit EMI and radio frequency (RF) interference from front panels or enclosures — making them ideal for high-density data communications and networking applications
- Mirror Mezz connectors and Open Compute Project (OCP)-standard Mirror Mezz Pro and Mirror Mezz Enhanced connectors, which are stackable and hermaphroditic mezzanine connectors that deliver superior signal integrity performance at data speeds up to 224 Gbps
- HSAutoLink connectors, which feature multiple keying options and full-length cable shielding for superior signal performance and reduced EMI — making them a good choice for in-vehicle connectivity
New ways to transfer energy from storage stations to portable devices will likely emerge over the next several years. As batteries for electric vehicles (EVs), homes and renewable installations proliferate, there will undoubtedly be a growing desire for reliable ways to put this energy into action — preferably on demand.
Higher power is the answer to quick EV charging, but voltage upgrades require a connectivity overhaul both in vehicles and at charge points. New designs also need to address safety risks and thermal effects.
Molex is responding with high-performance busbar, connector and cable assembly solutions designed especially for high voltages. Examples include:
- SW1 wire-to-board/wire-to-busbar interconnects, which incorporate innovative COEUR socket technology to enable high current-carrying capacity in three versatile sizes
- PowerWize high-current wire-to-board, wire-to-busbar interconnects, which come in two sizes and similarly leverage multi-beam COEUR socket technology to ensure low contact resistance, low voltage drop and minimal heat generation at the contact interface
- EXTreme Ten60 power connectors, which are specifically designed for high-power connections and offer multiple blade styles
The miniaturization trend will continue across many industries in the coming years, most prominently in RF/wireless devices, automotive, consumer electronics, data centers and edge computing. Designers will face the ongoing challenge of creating smaller assemblies with greater feature density — driven by evolving user expectations for high performance in slimmer, more compact and increasingly rugged packages.
Molex's commitment to efficient miniaturization has yielded innovative interconnect solutions that enhance functionality in limited component footprints. Examples to date include:
- ConnTAK50 connectors, which employ the versatile Arbeitskreis (AK) interface and offer both single-row and dual-row versions, along with two compact configurations to address space constraints
- Quad-Row connectors, which are currently the world’s smallest board-to-board connector and thus ideally suited for limited-space applications
- Nano-Change M8, which are rugged, space-saving and sealed connectors suited to industrial control applications
What’s the best connector for a 360-degree pivoting industrial robotic arm? In the next several years, the answer may be “one that isn’t there.” Contactless connectivity can offer untethered freedom of movement, while eliminating tasks involving repeated manual mating and de-mating. Transferring both power and signal a short distance through magnetic inductive coupling has hundreds of potential applications in industries like automotive, industrial and consumer electronics.
Although still an emerging technology, contactless connectivity could eventually improve reliability, increase ruggedness and lower costs compared to conventional mechanical connectors.
Crossover Innovations
Innovation is defined as creating or capturing value in new and different ways. Molex and Arrow Electronics continually collaborate with customers to identify and engineer innovative solutions for the needs of today and tomorrow. This gives us unique insight across industries, equipping us to adapt the latest connectivity solutions, technical breakthroughs and successful manufacturing techniques.
This proven ability to adapt with agility is crucial. After all, many of today’s top industry trends were originally inspired or adapted from alternate sectors. For instance:
- Vehicle infotainment is a confluence of popular features from consumer electronics and datacom infrastructure
- Medical technology companies refined miniaturized diagnostics, which now inform the future of consumer wearables
- Ongoing device consumerization reflects the application of user experiences from popular products like smartphones
As the next decade quickly approaches, Molex and Arrow will continue to invest in next-generation electronics connectivity, manufacturing methodologies, prototyping and predictive engineering for the benefit of customers in every industry. These proactive investments will facilitate faster development cycles, improved product quality and greater production flexibility over time. Contact us for expert support as you engineer a more efficient future.
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