e-MMC: The Right Choice for Lower Densities

KIOXIA’s large and high-performance lineup of e-MMC products, equipped with an integrated controller, support a high-speed memory interface compliant with JEDEC Version 5.0/5.1. This eliminates the need for the host processor to directly control flash memory.

Many applications cannot migrate to the latest generation of UFS. Therefore e-MMC remains as an important solution if lower density is required, or because the host processor does not yet support a UFS interface.

Manufactured in a 15nm process technology or the more advanced BiCS FLASH™ 3D flash memory, e-MMC is fitting for a wide range of applications requiring e-MMC as an embedded memory solution.


Key KIOXIA e-MMC Features

• Parallel interface
• C-Temp (-25℃ to 85℃) 4GB, 8GB, 16GB, 32GB, 64GB, 128GB
• I-Temp (-40℃ to 105℃) 8GB, 16GB, 32GB, 64GB
• 11.5 x 13mm 153ball BGA package
  (4GB also offered in 11 x 10mm package)
• JEDEC Standard

KIOXIA e-MMC Key Technology

Security - RPMB (Replay Protected Memory Block)

RPMB grant only authenticated access as well as prevents unauthorized data from being accessed in an RPMB partition. Between the e-MMC device and the host a unique authorized key is paired. The RPMB partition will be inaccessible if e-MMC is paired with a different host (or vice versa).

Automatic Sudden Power Loss Protection (PLP)

This built-in feature ensures that all data that has been stored in NAND will remain intact and not corrupted if sudden power loss occurs. It automatically restores the original data if writes are not completed before power loss occurs without the need for external capacitors or system back up power.

Well Established Ecosystem

With open-source software, chipsets and drivers e-MMC has broad ecosystem support. It supports lower density storage requirements and, therefore, allows for easy adoption with low design-in effort.


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