µModule data acquisition solution eases engineering challenges for a diverse set of precision applications

System architects and circuit-level hardware designers spend significant research and development (R&D) resources to develop high performance, discrete linear, and precision signal chain blocks for end applications (such as test and measurement, industrial automation, healthcare, or aerospace and defense) to measure and protect, condition and acquire, or synthesize and drive.

The electronic industry’s dynamics are rapidly evolving, and there is less time to build and prototype analog circuits to verify their functionality as the control of R&D budgets and time to market become challenging. 

Hardware designers are demanding advanced precision data conversion performance and increased robustness for complex designs in an ever-shrinking form factor amid thermal and printed circuit board (PCB) density limitations. Heterogeneous integration via system-in-package (SiP) technology continues to advance key trends within the electronics industry, including the move to higher density, increased functionality, enhanced performance, and longer mean time to failure (MTTF). 

This technical article illustrates how Analog Devices is leveraging heterogeneous integration to change the precision conversion playing field and provide solutions that make a significant application impact.

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