Typical Stereo Application Circuit for IM69D130 High-Performance Digital XENSIV MEMS Microphone
Infineon Technologies AG이 부품 IM69D130V01XTSA1 을 사용하는 참조 설계
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최종 제품의 경우
- Camcorder
- Cameras
- Conference System
- Home Automation
- IoT Applications
- Smart Speaker
Description
- Typical Application for IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortions and a high acoustic overload point is required. Dual Backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 105dB
피쳐링 부품 (2)
부품 번호 | Manufacturer | Type | Description | |||
---|---|---|---|---|---|---|
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IM69D130V01 | Infineon Technologies AG | Microphones | Mic Omni-Directional -36dB Square Solder Pad | 구매 | |
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IM69D130V01XTSA1 | Infineon Technologies AG | Microphones | Mic Omni-Directional -36dB Square Solder Pad | 구매 |