Typical Stereo Application Circuit for IM69D130 High-Performance Digital XENSIV MEMS Microphone

使用 Infineon Technologies AG 的 IM69D130V01XTSA1 的参考设计

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供应商

Infineon Technologies AG
  • 应用类别
    音频
  • 产品类别
    音频界面

依据最终产品

  • Camcorder
  • Cameras
  • Conference System
  • Home Automation
  • IoT Applications
  • Smart Speaker

说明

  • Typical Application for IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortions and a high acoustic overload point is required. Dual Backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 105dB

Featured Parts (2)

Featured Parts
零件编号 供应商 类别 说明
IM69D130V01 Infineon Technologies AG Microphones Mic Omni-Directional -36dB Square Solder Pad 买入
IM69D130V01XTSA1 Infineon Technologies AG Microphones Mic Omni-Directional -36dB Square Solder Pad 买入

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