Learn how the enhanced Surface-Mount Power packages (eSMP®) from Vishay offer a new frontier for the SMD package.
The growth in energy consumption and rise in carbon dioxide (CO2) emissions are issues that need to be addressed on a global scale. To conserve energy while meeting the increasing demand for electricity, it’s necessary to improve energy efficiency at all stages from electric power generation to electricity consumption.
To improve the energy utilization rate, there is strong demand for higher efficiency and downsized power supplies for industrial equipment, including automotive in-vehicle, server, and network equipment. As a result of this demand, emerging technologies have driven smaller, lighter, and thinner packages and PCB assemblies—and the electronics industry has gone a long way toward component miniaturization.
Realize Miniaturization
The geometric size and volume occupied by SMD electronic components are much smaller than that of through-hole interpolation components. They generally offer a size and volume reduction of 60% ~ 70%, and some components can provide a reduction of 90%. At the same time, component weight can be reduced by 60% ~ 90%.
Vishay offers a complete series of eSMP (enhanced Surface-Mount Power packages) to enable higher current and power efficiency with a unique design that promotes better thermal performance and reliability.
Standard Rectifiers with ESD Capability in eSMP® series
Diodes / Rectifiers in eSMP® Series
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