Miniaturization for smart IoT devices

Gain insights into overcoming miniaturization challenges associated with antenna design and PCB connectors and components.

There are unique challenges with integrating multiple wireless technologies into smart IoT devices, including the need to be waterproof and withstand high temperatures, shock and vibration. Rugged and robust designs, miniaturization, long battery life and high performance are all critical factors that allow these devices to deliver reliable, seamless connectivity.

Discover TE’s design considerations for overcoming these challenges in this informative white paper and
on-demand webinar.



LEARN MORE





Upcoming Events

Sorry, your filter selection returned no results.

请仔细阅读我们近期更改的隐私政策。当按下确认键时,您已了解并同意艾睿电子的隐私政策和用户协议。

本网站需使用cookies以改善用户您的体验并进一步改进我们的网站。此处阅读了解关于网站cookies的使用以及如何禁用cookies。网页cookies和追踪功能或許用于市场分析。当您按下同意按钮,您已经了解并同意在您的设备上接受cookies,并给予网站追踪权限。更多关于如何取消网站cookies及追踪的信息,请点击下方“阅读更多”。尽管同意启用cookies追踪与否取决用户意愿,取消网页cookies及追踪可能导致网站运作或显示异常,亦或导致相关推荐广告减少。

我们尊重您的隐私。请在此阅读我们的隐私政策。