Miniaturization for smart IoT devices
Gain insights into overcoming miniaturization challenges associated with antenna design and PCB connectors and components.
There are unique challenges with integrating multiple wireless technologies into smart IoT devices, including the need to be waterproof and withstand high temperatures, shock and vibration. Rugged and robust designs, miniaturization, long battery life and high performance are all critical factors that allow these devices to deliver reliable, seamless connectivity.
Discover TE’s design considerations for overcoming these challenges in this informative white paper and
on-demand webinar.
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