The evolution in data growth is driving a mandate for speed capacity across networks. Users seek faster data speeds and reduced latencies, in addition to increasingly robust environmental specs that let centers run hotter to reduce cooling costs.
Modern data centers are now asked to support next generation applications with 100G+ transfer speeds while maintaining signal integrity. When clients call for the capability to transfer 12.5 Gbps—for example, if they would like four hours of HD video content delivered instantaneously—data centers can look to Amphenol High Speed Interconnects® (AHSI®), to provide industry leading technology with their Ultraport™ product solutions. These high speed interconnects address emerging trends for higher speeds, better application performance and reducing latencies.
The Small Form-factor Pluggable (SFP) connector has evolved over time. The early SFP model interfaces were transmitted at 5Gbps, but the potential for growth was built in the product. The SFP ports are “standardized” by not being standardized as their multi-source agreements (MSAs) strictly define the baseline characteristics of the transceiver. SFP solutions purchased from any MSA compliant vendor will function within the system, giving clients an entire market to choose from.
When the free market reigns and multiple options are available to customers, manufacturers must innovate to stay competitive. Amphenol did this by first developing the SFP+ transceiver capable of transferring 16Gbps, and then developing the QSFP+ system- “quad-” SFPs—Four SFP+ connections in a single port—allowing for transfer speeds of 40Gbps+.
Electromagnetic Interference (EMI) is unavoidable in transfer systems; parts that cause EMI must be counteracted within the design of the product. By simplifying the design process of the Ultraport product line, Amphenol has tackled EMI performance head on. The cages feature through-panel or behind-the-panel EMI sealing options with available integrated elastometric or foam gaskets. There are also cage designs available that eliminate some of the cooling holes on the rear wall, which reduces or eliminates any EMI from the transceiver mating area. The improved EMI performance of the connector interface in the high speed Ultraport solution allows engineers to have more flexibility when designing the actual board.
Amphenol offers design flexibility in a variety of ways. The Ultraport SFP+ is a 20 position, 0.8mm pitch connector with speeds up to 28Gbps per channel. The Ultraport QSFP+ connector system has 38 positions with a 0.8mm pitch with up to 28Gbps per channel making Amphenol’s solution the fastest connector in the QSFP+ market. Both the SFP+ and the QSFP+ deliver best in class performance with various heat sink and light pipe options. They are also available in single, ganged and stacked configurations. Amphenol also offers customization options including number of ports per row (single port up to 2x6 stacked), vent hole size and shape configuration (large and small, with a rectangular option), EMI cover, light pipe configuration and various heat sink options.
The technology and customizations are forward thinking, but the Ultraport SFP+ system is backwards compatible. The Ultraport SFP+ mating end is compliant with SFF-8432, which means it mates with existing SFP modules. The overall envelope height, width, and depth fits into existing cages, and the foot print is compatible with SFF-8432 due to the simple addition of two ground SMT plate pads. Amphenol also allows for upgrades as needed which provides engineers with a degree of flexibility.
Signal integrity is fundamental to data transfer. High speed interconnects must constantly battle signal degradation. Improved signal quality allows for higher speed data links and longer runs. Traditionally, the connector is one of the weakest links in the overall interconnect in terms of impedance discontinuities because signals encounter difficult geometries, however, the Amphenol Ultraport QSFP+ product solution offers more consistency by design. The maximum insertion loss is 1.0dB at 16Ghz and the return loss is less than -10dB at 16GHz. Far End Cross Talk is less than -30dB. These characteristics keep losses linear and predictable allowing for accountability.
Amphenol’s conductive polymer material and savvy material placement is designed with resonance dampening in mind. The base material is a phosphor bronze and the plating in the mating area is 30 microinches of gold over 50 microinches of nickel at the minimum. The solder tails are 100 microinches of tin over 50 microinches of nickel. The housing is made of reflow process compatible thermoplastic that is glass reinforced and lead free. The images below shows how signal degradation can affect the eye diagram. The left is clear, the right is degraded.
The Ultraport product line was carefully designed beyond signal integrity. For those concerned with environmental specs, the Ultraport products tackle cooling issues by offering multiple thermal solutions. The Ultraport solution also allows for both fin style and pin style heat sink and clip combos in nickel plated material, with heights available in 4.2mm, 6.5mm and 13.5mm options. The heat sink design is tested and true. Amphenol used full FloTHERM CFD simulation techniques to predict temperature, heat transfer, and airflow. This high speed product solution was specifically designed to permit airflow through the connector, reducing EMI at the same time as improving the handling of heat coming from the transceivers.
Mechanically, the advantage that the Ultraport solution offers can be summed up as strength through simplicity. The reduced wafer count forgoes unnecessary complexity, with robust results. The new four-wafer design does what the older ten-wafer design did, only better, and with less chance for wear and tear and fewer components that could cause reliability issues. The Ultraport solution is durable to a minimum of 200-250 Mating Cycles, has a max insertion force of 40-80 N and a maximum withdrawal force of 30-50 N.
Amphenol’s Ultraport solutions offer the type of customization that gives engineers the freedom to innovate. With form pluggable designs, versatile connectors and architecture, and diverse configurations that allow solutions to be placed in multiple environments, engineers do not have to worry about finding the right fit. Despite all the customizable options available, there is one thing that remains constant across the line: Ultraport solutions are designed around performance. Regardless of the configuration of choice, these solutions are guaranteed to provide engineers with the type of industry-leading speed Amphenol is known for.