Pre-Certified low power application wireless module for Bluetooth® low energy v5.2, Zigbee® 3.0, OpenThread and open 2.4 GHz radio Multi-protocol
DUAL-CORE ARCHITECTURE
• Dedicated Ultra-low power Arm® Cortex®-M0+ for radio and security tasks
• Dedicated Arm® Cortex®-M4 CPU with FPU and ART (adaptive real-time accelerator) up to 64 MHz speed for application code
• core @ 32MHz
• Programmable embedded 1MB Flash
• 256 kB embedded RAM
CERTIFIED RF INTERFACE
• FCC, CE, NCC, JRF, KC, SRRC, ISED, GOST
The STM32WB5MMG wireless module addresses 2.4 GHz solutions with Bluetooth® LE, and 802.15.4 protocols, including Zigbee, Thread, as well as proprietary protocols. Based on the STM32WB55 MCU which offers 1 Mbyte of Flash and is packaged in WLCSP100, this module is ready-to-use and embeds the full reference design up to the antenna for faster market introduction. It offers performance, multi-protocol flexibility, security features, the same ultra-low power features as STM32WB wireless MCUs, and its certifications ensure wide geographical coverage. Fully part of the STM32WB portfolio, the STM32WB5MMG is included in ST’s longevity program, ensuring continuous supply for 10 years.
Key Features:
• Integrated chip antenna
• Bluetooth® Low Energy 5.0, Zigbee® 3.0, OpenThread certified
• Dynamic and static concurrent modes
• IEEE 802.15.4-2011 MAC PHY
• Supports 2 Mbits/s
• TX output power up to +6 dBm
• RX sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
• Range: up to 75 meters • Dedicated Arm® Cortex®-M0+ for radio and security tasks
• Dedicated Arm® Cortex®-M4 CPU with FPU and ART (adaptive real-time accelerator) up to 64 MHz speed
• 1-Mbyte Flash memory, 256-Kbyte SRAM
• Fully integrated BOM, including 32 MHz radio and 32 KHz RTC crystals
• Integrated SMPS • Ultra-low-power modes for battery longevity
• 68 GPIOs
• Integrated IPD for best-in-class and reliable antenna matching
• Built-in security features such as: secure firmware installation (SFI) for radio stack, customer key storage/key management services, PKA, AES 256-bit, TRNG, PCROP, CRC, 96-bit UID, possibility to derive 802.15.4 and Bluetooth® Low Energy 48-bit UEI
• Certifications: CE, FCC, IC, JRF, SRRC, RoHS, REACH, GOST, KC, NCC
• Two layers PCB compatible (using external raw pins only)
• Operating supply voltage: from 1.8 to 3.6 V VDD
• Operating temperature range: -40 °C to 85 °C
• Small form factor: 7.3 mm x 11 mm x 1.34 mm
• Included in ST’s 10-year longevity program
Module Overview:
The module is a SiP-LGA86 package (system in package land grid array) that integrates the proven STM32WB55VGY MCU with several external components. The package includes:
• LSE crystal
• HSE crystal
• Passive components for SMPS
• Antenna matching and antenna
• IPD for RF matching and harmonics rejection
Evaluation Boards:
• STM32WB5MMG-DK: Designed as complete demonstration and development platforms for STMicroelectronics Arm®-based on Cortex®-M4 32 bits and Cortex®-M0+ 32-bits MCUs in the STM32WB5MMG Series.
• Perfect match to application development based on Bluetooth® Low Energy 5.2, and 802.15.4 protocols with Zigbee, Thread as standalone or concurrent mode and proprietary protocols. Hardware features of the Discovery kits are available for users to develop various applications like Audio, lighting, home & building automation, IoT, Remote controller and equipped with Touch sensing, sensors, USB, and an external flash memory.
Bottom View (ARDUINO connectors)
• The Extension headers allow easy connection of an ArduinoTM board for a specific application.
• An ST-LINK/V2-1 (UART console) is integrated on the board, as embedded in-circuit debugger and programmer for the STM32 MCU and the USB Virtual COM port bridge.
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